Technical Capabilities

Pad Repair

Process of replacing damaged DUT pads, component terminals, pogo traces and edge fingers to convey the original functionality of the contact points.
  Land Edge Finger Plated Thru Holes Terminal
Before
After

Pad Re-Plating

Process of re-coating abraded DUT pads, component terminals, pogo traces and edge fingers to convey the original functionality of the devices contact points.

Note: Plating also applicable on probe pins (both vertical and cantilever, pogo pins, socket pins, component terminals and jewelries

Plating of probe pins contact will extend the life span of the probe pins. It will also eliminate poor contact in between wafer pads and probe pins

Repair of Damaged DUT Pads + Plating

  • Visual Inspection

  • Pad Repair

  • Pad Plating

  • Continuity Check

  • Planarity Check

  • Outgoing

Pad Plating of Abraded, Faded gold coating of the DUT pads

  • Visual Inspection

  • Pad Plating

  • Planarity Check

  • Outgoing

Note: Repair can be performed onsite and/or offsite. It depends on the requirements.