Our Fabrication


Vietnam Facility

  • Developed a full service PC Board Manufacturing Facility located in Vietnam
  • The facility is in Vietnam Singapore Industrial Park , Thuan An District
  • 75,000 Square Foot – Two Story Building
  • Fully Self Contained and Equipped
  • 200 full time workers
  • Three shifts

USA Facility

  • Our PCB FAB House was established in 1995, in Milpitas, California, USA
  • Self contained facility of >18,000 sq. ft.
  • Extensive customer base
  • Excellent product quality and on time delivery record.
  • To comply with our customer's requirement for a large volume PCB production, we gladly offer our Vietnam Facility.

Complete Line of Fabrication

  • Strong front end technical capabilities
  • We got the latest state of the art equipment and technology (e.g. fixtureless testers, plasma etch and laser drill)
  • Built in redundancy in equipment, so that there's zero down time
  • Employing the latest pollution control systems
  • Excellent and responsive technical support for customers
  • Constant upgrading of our manufacturing capabilities and processes
  • Inspection conforms to IPC-650 standards class II and III.

Material and Laminates

  • FR-4 Multi-Functional (140C)
  • FR-4 High Temp (180C)
  • FR407/FR408
  • Nelco 4000 Series
  • IS410 and 370HR
  • Polyimide
  • GETEK
  • Rogers 4000 Series
  • 370HR Series

Board Geometry

  • Min board size: 1" x 1"
  • Max board size: 30" x 30"
  • Min board thickness: 0.005"/0.127mm
  • Max board thickness: 0.250"/6.35mm
  • Thickness tolerance: +/- 5mils
  • Cu weight: 0.25 Oz - 6 Oz
  • Bow and Twist: 0.5%
  • Maximum Layers: 60

Line and Spacing

  • Trace width min (inner): 3-2 mils (Cu weight dependent)
  • Trace width min (outer): 4-2 mils (Cu weight dependent)
  • Min space (inner/outer layer): 3/3 mils
  • Tolerance: +/- 20%
  • Fine-line width and trace spacing: 2/2 mils (using laser and/or plasma etching)

Drill and Aspect Ratio

  • Minimum drilled hole size: 0.2mm/7.87mils
  • Maximum drilled hole size: 6.5m/256mils
  • NPTH hole tolerance: +/- 2mils
  • Min finished hole size (PTH – 062): 0.1mm/3.94mils
  • Min finished hole size (PTH – 120): 0.35mm/13.78mils
  • PTH hole tolerance: +/- 2mils
  • Drill hole gap to trace/pad: 4mils
  • 25:1 Aspect Ratio
  • Depth controlled, blind via, buried via, pad over via, filled via

Plating/Surface Finish

  • Copper Plating: up to 400 µinches
  • Tin-Nickel Plating
  • Electroless Nickel: 120 to 200 µinches thickness
  • Electrolytic Nickel: 350 µinches thickness
  • ENIG: 2 to 6 µinches thickness
  • Full body gold (Hard Gold): up to 100 µinches
  • Selective Gold: up to 100 µinches
  • Soft Bondable Gold
  • Hot Air Solder Level (HASL)

Soldermask and Silkscreen

  • Soldermask clearance pad : 2 mils
  • Clearance Pad to Trace edge : 3 mils
  • Minimum solder dam: 3 mils
  • Soldermask thickness: 0.4mils
  • We use Liquid Photo-Imageable with spray systems
  • Soldermask over bare copper (SMOBC)

Impedance Control

  • Impedance controlled trace: 50 ohms/75 ohms/others
  • (Applicable for differential or single trace)
  • Tolerance > 50 Ohms: +/- 10 Ohms
  • Tolerance < 50 Ohms: +/- 5 Ohms

Electrical Testing

  • Flying Probe & Grid Test Fixtureless
  • Double side test 10-100 volt
  • Continuity resistance 10-30 Ohms
  • Isolation resistance 2.5-10.0 MegOhms
  • Full Net List Test
  • Polar/TDR for impedance testing
  • We provide PCB cross section if requested!