PCB Design Capabilities

  • Analog, Digital, Mixed Signal, RF Applications
  • High Speed/Impedance Controlled boards
  • Equal trace lengths & Differential pairs
  • High current/heavy Cu board
  • EMI/EMC compliance board
  • Use of microvia, pad over via, blind via, buried via
  • High density interconnect (HDI) technology
  • Complies to IPC design standards
  • Complete assembly drawings if needed
  • Professional fabrication documents

 

Design Requirements

  • Bill of Materials/BOM List
  • Schematic Diagram
  • Package Outline Drawing (for loadboard, DUT, BIB)
  • Board Outline/Template (for loadboard, DUT, BIB)
  • Mechanical Drawings e.g. Socket, stiffener, case enclosure, etc
  • Special instructions on placement and routing, critical traces, impedance or differential pairs
  • Special instructions on layer stack up/hybrid laminates

Fabrication Requirements

  • Gerber File (R274X)
  • NC Drill
  • Fabrication Notes
  • Special Instructions if needed

Supported Platforms

  • Teradyne: uFlex, Catalyst, A565, J750
  • Credence: ASL1K,3K, VISTA, DUO, QUARTET, SC212, SC312
  • Eagle: ETS-364
  • Nextest: PT1 & 2, Lightning, VT, GT, Magnum
  • Hewlett Packard/Agilent: Verigy, 93K
  • LTX, Sentry, MCT
  • FPC; RIGID FLEX

Reverse Engineering Services

  • FSA can do reverse engineering of obsolete OEM circuit boards, missing manufacturing data and the like.
  • We use state-of-the-art LASER SCAN on single, dual and multi-layer boards.
  • Output can be a Gerber file or in DXF format
  • Because of laser technology, we guarantee 100% board reproducibility anytime, all the time.